454 Students Graduate From Sidec's ASEM Semiconductor Programme
KUALA LUMPUR, July 28 (Bernama) -- A total of 454 students have graduated from the Advanced Semiconductor Academy Malaysia (ASEM) semiconductor programme run by the Selangor Information Technology and Digital Economy Corporation (Sidec).
In a statement today, Sidec said the graduates completed training across nine cohorts held between February 2025 and June 2026, with 85 per cent graduating from ASEM’s National Semiconductor Excellence Programme (NSEP) and the remaining 15 per cent from the Global Semiconductor Exchange Programme (GSEP).
“Together, the two programmes provided participants with specialised technical training, practical learning opportunities, and industry exposure, strengthening the pipeline of skilled talent needed to support Malaysia’s ambitions in the semiconductor and technology sectors,” it said.
The graduates were recognised at the Malaysian Talents Graduation and Appreciation Ceremony held in Puchong today.
The graduates, comprising engineering undergraduates, fresh graduates and working professionals, completed training in digital integrated circuit (IC) design, analogue IC design, embedded system firmware, embedded Internet of Things (IoT) and artificial intelligence (AI) robotics.
According to Sidec, the graduates came from various higher education institutions, including Universiti Teknologi MARA, Universiti Teknologi Malaysia, Universiti Malaysia Perlis, Universiti Putra Malaysia, Universiti Malaya, Universiti Teknikal Malaysia Melaka, Universiti Teknologi Petronas and Multimedia University.
NSEP is a four-month intensive chip design training programme designed to equip unemployed and underemployed engineers, fresh graduates and working professionals with industry-ready semiconductor skills.
The programme features hands-on laboratories, coursework in IC design and fabrication, mentorship from semiconductor experts, and is fully sponsored, covering training fees, learning materials and meals.
In addition, GSEP complements the national training effort by enabling participants to deepen their semiconductor expertise through specialised training and international industry exposure.
The one-month programme is conducted in collaboration with international partner institutions and experts, offering two specialised tracks, namely analogue IC design and layout in Shenzhen, China, and microprocessor chip design in India.
Both programmes are conducted in collaboration with the K-Youth Development Programme, an initiative by Khazanah Nasional Bhd.
Sidec said the event also featured an Arm Flexible Access (AFA) briefing by the Malaysian Investment Development Authority, introducing local IC design companies and graduates to the programme, which provides early, cost-effective access to Arm’s semiconductor intellectual property (IP) portfolio, including core processing units, graphics processing units, neural processing units and system interconnects.
“This enables companies to explore, develop and validate chip designs without incurring full upfront licensing costs, lowering barriers to innovation and accelerating Malaysia's transition towards front-end IC design and homegrown semiconductor IP development,” it said.
Sidec said the briefing was followed by an AFA token application clinic, where participating companies received guidance on the application process and programme requirements.
“Pairing the briefing and clinic with the graduation ceremony was a deliberate move to close the gap between training and industry-readiness.
“For the 454 graduates, it offered a first, direct look at the very IP and design tools they are likely to work with as they enter the workforce, turning the skills learned in the classroom into a clearer picture of what comes next on the job,” it said.
Sidec also noted that the graduation ceremony comes against the backdrop of continued growth at the Malaysia Semiconductor IC Design Park in Puchong, which it developed and manages.
It said that, as of 2026, the park has 18 companies onboard, with two more expected to join.
“On the talent front, the IC Design Park has increased the target number of engineer headcount to 450 by 2026, building on a current base of 380 engineers, with 140 more expected to join,” Sidec said.
-- BERNAMA